About this item
- Suitable for : Adapted to the mobile phone repair industry, computer digital service industries, High-precision circuit board soldering SMT, BGA soldering processes, etc.
- Specifications Type: XG-z40 Alloy: Sn63/Pb37 Microns: 3# Weight: 35g
- Needle Shaped Xg-z40 Solder Paste Flux Sn63/Pb37 Syringe to Mobile Phone BGA Repairing
- with syringe and needle
Needle Shaped Xg-z40 Solder Paste Flux Sn63/Pb37 Syringe to Mobile Phone BGA Repairing Product Description Description: The quality of solder paste, excellent wetting, high reliability. Can effectively prevent the collapse of the printing and preheat, Tack lasting, easy to dry, sticky time for more than 48 hours. A colorless transparent, does not affect the test, fine-clean and cleaning performance. Products wetting, anti-dry and strong, long shelf life at room temperature Suitable for Adapted to the mobile phone repair industry, computer digital service industries, High-precision circuit board soldering SMT, BGA soldering processes, etc. Specifications Type: XG-z40 Alloy: Sn63/Pb37 Microns: 3# Weight: 35g Packing list: MECHANIC XG-Z40 10cc x 1pcs
Brand | MECHANIC |
---|
Manufacturer | MECHANIC |
---|
Model | Sn63/Pb37 |
---|
Product Dimensions | 12 x 4 x 10 cm; 250 g |
---|
Item model number | Sn63/Pb37 |
---|
Mounting Hardware | Syringe Paste |
---|
Number of items | 1 |
---|
Form Factor | ATX |
---|
Manufacturer | DHRUVPRO |
---|
Country of Origin | India |
---|
Item Weight | 250 g |
---|