FNIRSI SAG-55 – Intelligent 550W Hot Air Rework Gun for Precision SMD Soldering & Electronics Repair

Take your electronics repair workflow to the next level with the FNIRSI SAG-55, a smart, high-performance 550W hot air rework station built for the precision demands of SMD soldering, desoldering, and microelectronics restoration. Designed with cutting-edge technology, this tool offers a balanced fusion of temperature accuracy, intelligent airflow control, and user-friendly design—making it an indispensable device for both professional technicians and advanced DIY enthusiasts.

Advanced Engineering for Maximum Control

At the heart of the SAG-55 is its intelligent PID temperature control system, which monitors and adjusts the heat output in real-time to maintain stable operation—critical for sensitive electronics work. Paired with a digitally regulated airflow system, you gain complete command over heat distribution, ensuring safe, efficient, and targeted hot air delivery to even the most compact SMD components.

• Temperature Range: 100°C to 500°C

• Airflow Range: 20–120 L/min (adjustable)

• Heating Element: High-efficiency ceramic heater for rapid warm-up

• Display: Backlit digital LCD for easy temperature/airflow monitoring

Quiet & Durable Brushless Motor

Unlike traditional rework guns, the SAG-55 uses a high-performance brushless fan motor that delivers silent, vibration-free operation, along with an extended operational lifespan. This not only enhances comfort during extended usage but also reduces wear and tear on internal components, keeping your rework station running smoothly for years.

Smart Features That Work With You

• Auto Sleep Mode: Automatically cools down and powers off when idle, protecting the heating core

• Memory Function: Remembers last temperature and airflow settings for faster startup

• Safety Lock: Prevents accidental temperature changes during operation

• Overheat Protection: Ensures safety for both user and equipment

Versatile Application Range

Whether you're reworking BGA chips, removing surface-mounted ICs, shrinking heat sleeves, or repairing multilayer PCBs, the SAG-55 delivers consistent performance. Compatible with a wide variety of interchangeable nozzles, it's adaptable for precise, wide, or focused heating tasks.

Ideal For:

• SMD/SMT soldering & desoldering

• Mobile phone, laptop, and console repair

• BGA reballing and IC replacement

• PCB component rework

• Heat shrink tubing, plastic welding, and more