Inhouse product
The DHRUVPRO Sn63/Pb37 SMD Solder Paste (35g) is a high-quality, leaded soldering solution engineered for professional electronics assembly and PCB repair work. Designed for surface-mount technology (SMT), BGA reballing, and fine-pitch SMD components, this paste delivers smooth solder flow, quick wetting, and strong, reliable joints.
Packaged in a 35g syringe with an alloy push rod and precision needle, the kit allows for clean and controlled application on even the most delicate circuit boards. The alloy composition of 63% tin and 37% lead (Sn63/Pb37) provides excellent conductivity and a low melting point, making it ideal for hand soldering, reflow ovens, or hot air guns.
⚙️ Composition: Sn63/Pb37 – Optimal balance for consistent solder flow
? Flux Type: Rosin-based, pre-mixed with 2% flux core
? Form Factor: 35g sealed syringe with push rod & dispensing needle
? Melting Point: Low (~183°C) – safe for sensitive components
? Application: Ideal for SMD/SMT, BGA, QFP, DIP, PCB rework & IC soldering
? Cleanliness: No-clean formula with minimal residue
?️ Use Cases: Phone motherboard repair, LED PCB soldering, DIY electronics, reballing stations
Brand: DHRUVPRO
Model: Sn63/Pb37 SMD Paste
Weight: 35g
Flux Content: 2% rosin flux
Alloy Ratio: Tin 63% / Lead 37%
Needle Included: Yes (Precision type)
Push Rod: P08 Alloy applicator included
Shelf Life: 12 months (cool & dry storage recommended)
Micro soldering on phone/laptop motherboards
Fine-pitch components like QFN, SOP, BGA
LED module rework
Home electronics repair kits
SMT production line or service center use
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