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NC-560-LF is a lead-free, no-clean, halogen-free solder that provides improved solderability with all Pb-Free metallization, including ENIG (Gold), OSP, HASL and immersion silver tips. NC-560-LF is RoHS-compliant and increases production yields with its unparalleled batch-to-batch and stencil print consistency, and offers superior print performance characteristics including excellent wetting, high activity, ideal viscosity, long stencil life, thermal stability up to 300C, and minimal residue. NC-560-LF is also low pearling, low urination, and anti-tombstoning to reduce scrap and rework.
This 100g NC-560-LF NO CLEAN flux is 100% lead free and original.
This NC-560-LF NO CLEAN flux is halogen and halide free as a great all paste design.
This NC-560-LF NO CLEAN flux is a lead-free solder flux in the most commonly seen alloy (SAC305)
it prints exceptionally well, tucked in a wide range of profiles and lovely shinny joint shapes.
This NC-560-LF NO CLEAN Stream is defined as an OFFSHORE by IPC testing and it has great MR results. easy to use, clear light-residue, it is a great all paste design.
it has a long stencil life and low urination.
This NC-560-LF NO CLEAN flux is perfect for wetting on most boards and for exceptional print definition.
it can also be ordered for DEK Proflo or Speedline/MPM Rheo pump.
this amtech NC-560-LF NO CLEAN Flux makes their own powder. the powder is widely seen is competitive solder pastes and is excellent. This is a SAC305 alloy Type 3 powder. In other words the alloy is Sn96.6Ag3.0Cu0.5 and it has a 25-45 micron powder diameter.
It can print 20 mil pitch parts like Qfp AT or other semiconductor packages.
its viscosity is designed for printing. automatic printers or printing by hand are easy to do. the viscosity is 650 to 900Kcps. Dispensable grades with lower viscosity are available.
The Tack strength is about 35g. This means pieces placed in the printed paste will not move or skew.
It can reflow into standard profiles with a normal 5 minute door-to-door reflow. it can be reflowed shorter or longer profiles and even with a heating plate. it needs about 60 seconds above 219oC. domain reports show it is tolerant of reflow variations.