Inhouse product
Unlock professional-grade soldering performance with the AMTECH NC-559-ASM TPF 100g No-Clean Solder Flux Paste – a high-quality, industry-standard solution for precision electronics rework. Formulated to meet the demands of modern PCB repair and micro-soldering, this advanced no-clean flux paste ensures excellent wetting, minimal residue, and superior thermal stability, making it the perfect companion for both beginner technicians and advanced rework engineers.
Specially designed for BGA (Ball Grid Array) rework, SMT (Surface Mount Technology), and SMD (Surface Mount Devices) processes, this flux paste helps achieve clean, reliable solder joints without the need for additional cleaning after application.
No-Clean Formula – Leaves virtually no residue, saving time and eliminating the need for harsh chemical cleaning after soldering.
Perfect for BGA & PCB Rework – Ideal for chip-level repairs on laptops, smartphones, game consoles (PlayStation, Xbox), and other electronics.
Smooth Viscosity for Easy Application – Easily applied using a syringe, brush, or reflow method; perfect for reballing and soldering under microscopes.
Wide Compatibility – Works with leaded and lead-free solder; non-corrosive and halogen-free to ensure long-term component safety.
Professional 100g Pack – Large volume for repair shops, electronics assembly lines, and frequent home DIY users.
Enhanced Thermal Stability – Performs consistently under high temperatures, ideal for hot air rework stations and IR reflow ovens.
BGA chip reballing and rework
SMD and SMT soldering and desoldering
PCB track and pad repair
Console and motherboard repair
Mobile phone and tablet rework
Component replacement and micro-soldering
Model: NC-559-ASM TPF
Type: No-Clean Solder Flux Paste
Weight: 100 grams
Color: Amber/Brown
Viscosity: Medium
Storage: Cool, dry place (refrigeration recommended for long-term use)
Shelf Life: 12–18 months when properly stored
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