The LF-4300-TF is a medium viscosity water-washable, no-clean flux designed for tin-lead and lead-free alloys. LF-4300-TF is ideal for BGA, PGA and CSP sphere or pin attachment. Can be dot dispensed or screen printed. LF-4300-TF can be used with either tin-lead or lead-free alloys.
Brand: AMTECH
Model : NC-559-ASM
Volume : 100 g / bottle
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.
Feature :
Excellent capacity of solder-stickiness
Excellent Anti-wet Capacity
Widely used on BGA, PGA, CSP packages and flip chip operation
Suitable for multiple PCB reflow
No-clean and Lead free for environmental protection